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| intel? next unit of computing board DCP847SKE technical product specification may 2013 order number: g81548 - 00 3 the intel next unit of computing board DCP847SKE may contain design defects or errors known as errata that may cause the product to deviate from published specifications. current characterized errata are documented in the intel next unit of computing board DCP847SKE specification update.
revision history revision revision history date 001 first release of the intel ? next unit of computing board DCP847SKE technical product specification january 2013 002 specification clarification january 2013 003 specification clarification may 2013 this product specification applies to only the standard intel ? next unit of computing boar d with bios identifier gkppt10h.86a . information in this document is provided in connecti on with intel ? products. no license , express or implied, by estoppel or other wise, to any intellectual property right s is granted by this docu ment. except as prov ided in intel?s terms and conditions of sale f or such products, intel assumes no liability whatsoever, and intel disclaims any express or implied warranty, re lating to sale and/o r use of intel produ cts including liabil ity or warranties relating to fitness for a particular purpose , merchantability, o r infringement of any patent, copyright or other intellectual p roperty right. unles s otherwise agreed in writing by intel, the intel products are not designed nor int ended for any application in which the failure of the intel product co uld create a situati on where personal injur y or death may occur . all intel ? next unit of computing boards are evaluated as information technology equipment (i.t.e.) for use in personal computers (pc) for installation in homes, offices, schools, computer rooms, and similar locations. the suitability of this product for other pc or embedded non - pc applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by intel. intel corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter . the furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights . intel may make changes to specifications and product descriptions at any time, without notice. des igners must not rely on the absence or characteristics of any features or instructions marked ?reserved? or ?undefined.? intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. intel next unit of computing boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. current characterized errata are available on request. contact your local intel sales office or your distributor to obtain the latest specifications before placing your product order. intel and intel celeron are trademarks of intel corporation in the u.s. and/or other countries. * other names and brands may be claimed as the property of others. copyright ? 2013 , intel corporation. all rights reserved. iii board identification information basic intel ? next unit of computing board DCP847SKE identification information aa revision bios revision notes g79416 - 10 3 gkppt10h.86a.002 8 1 ,2 notes: 1. the aa number is found on a small label on the component side of the board. 2. the intel ? qs77 pch and intel ? celeron ? processor 847 used on this aa revision consists of the following component s: device stepping s- spec numbers intel celeron 847 q0 sr08n intel bd82qs77 c1 sli8b specification changes or clarifications the table below indicates the specification changes or specification clarifications that apply to the intel ? desktop board DCP847SKE . specification changes or clarifications date type of change description of changes or clarifications january 2013 spec clarification deleted the note in section 3.8 on page 60 regarding removing power before setting or clearing the hard disk drive password. may 2013 spec clarification ? replaced table 4 . supported memory configurations . ? added a sentence to the caution in section 2.5.1 to reference 1 x 2 power connecto r part information. ? deleted a sentence from the caution in section 2.5.1 that referred to a plastic lid in the accessories box. errata current characterized errata, if any, are documented in a separate specification update. see www.intel.com/nextunitofcomputing for the latest documentation. intel desktop board DCP847SKE technical product specification iv v preface this technical product specification (tps) specifies the board l ayout, components, connectors, power and environmental requirements, and the bios for intel ? next unit of computing board DCP847SKE . intended audience the tps is intended to provide detailed, technical information about intel next unit of computing boar d DCP847SKE and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. it is specifically not intended for general audiences. what this document contains chapter description 1 a descrip tion of the hardware used on intel next unit of computing board DCP847SKE 2 a map of the resources of the intel next unit of computing board 3 the features supported by the bios setup program 4 a description of the bios error messages, beep codes, and post codes 5 regulatory compliance and battery disposal information typographical conventions this section contains information about the conventions used in this specification. not all of these symbols and abbreviations appear in all specifications of this type. notes, cautions, and warnings note notes call attention to important information. caution cautions are included to help you avoid damaging hardware or losing data. intel desktop board DCP847SKE technical product specification vi other common notation # used after a signal name to identify an active - low signal (such as usbp0#) gb gigabyte (1,073,741,824 bytes) gb/s gigabytes per second gb/s gigabits per second kb kilobyte (1024 bytes) kb kilobit (1024 bits) kb/s 1000 bits per second mb megabyte (1,048,576 bytes) mb/s megabytes per second mb megabi t (1,048,576 bits) mb/s megabits per second tdp thermal design power xxh an address or data value ending with a lowercase h indicates a hexadecimal value. x.x v volts. voltages are dc unless otherwise specified. * this symbol is used to indicate thir d- party brands and names that are the property of their respective owners. vii contents revision history board identification informat ion .................................................................. iii errata ...................................................................................................... iii preface intende d audience ..................................................................................... v what this document contains ..................................................................... v typographical conventions ......................................................................... v 1 product description 1.1 overview ......................................................................................... 11 1.1.1 feature summary ................................................................ . 11 1.1.2 board layout (top) ............................................................... 13 1.1.3 board layout (bottom) .......................................................... 15 1.1.4 block diagram ...................................................................... 17 1.2 online support ................................................................................. 18 1.3 processor ........................................................................................ 18 1.4 system memory ............................................................................... 19 1.4.1 memory configurations .......................................................... 20 1.5 intel ? qs77 express chipset .............................................................. 22 1.5.1 direct media interface (dmi) .................................................. 22 1.5.2 display interfaces ................................................................ . 22 1.6 graphics subsystem ......................................................................... 22 1.6.1 integrated graphics ............................................................... 22 1.6.2 usb ..................................................................................... 24 1.7 sata interface ................................................................................. 24 1.7.1 ahci mode ........................................................................... 24 1.8 real - time clock subsystem ............................................................... 25 1.9 lan subsystem ................................................................................ 25 1.9.1 intel ? 82579v gigabit ethernet controller ................................ 26 1.9.2 lan subsystem software ....................................................... 26 1.9.3 rj- 45 lan connector with integrated leds .............................. 27 1.10 hardware management subsystem ..................................................... 28 1.10.1 hardware monitoring ............................................................. 2 8 1.10.2 fan monitoring ...................................................................... 28 1.10.3 thermal solution ................................................................... 29 1.11 power management .......................................................................... 30 1.11.1 acpi .................................................................................... 30 1.11.2 hardware support ................................................................ . 32 intel desktop board DCP847SKE technical product specification viii 2 technical reference 2.1 memory resources ........................................................................... 35 2.1.1 addressable memory ............................................................. 35 2.1.2 memory map ......................................................................... 37 2.2 connectors and headers .................................................................... 37 2.2.1 back panel connectors ........................................................... 38 2.2.2 connectors and headers (bottom) ........................................... 39 2.3 bios setup configurat ion jumper ....................................................... 46 2.4 mechanical considerations ................................................................ . 48 2.4.1 form factor .......................................................................... 48 2.5 electrical considerations .................................................................... 49 2.5.1 power supply considerations .................................................. 49 2.5.2 fan header current capability ................................................ 50 2.6 thermal considerations ..................................................................... 50 2.7 reliability ......................................................................................... 53 2.8 environmental .................................................................................. 53 3 overview of bios features 3.1 introduction ..................................................................................... 55 3.2 bios flash memory organization ........................................................ 56 3.3 system management bios (smbios) ................................................. 56 3.4 legacy usb support ......................................................................... 56 3.5 bios updates .................................................................................. 57 3.5.1 language support ................................................................ . 57 3.5.2 custom splash screen ........................................................... 58 3.6 bios recovery ................................................................................. 58 3.7 boot options .................................................................................... 59 3.7.1 network boot ........................................................................ 59 3.7.2 booting without attached devices ........................................... 59 3.7.3 changing the default boot device during post ......................... 59 3.8 hard disk drive password security feature .......................................... 60 3 .9 bios security features ..................................................................... 61 4 error messages and blink codes 4.1 front - panel power led blink codes ..................................................... 63 4.2 bios error messages ........................................................................ 63 4.3 port 80h post codes ........................................................................ 64 5 regulatory compliance and battery disposal information 5.1 regulatory compliance ...................................................................... 71 5.1.1 safety standards ................................................................... 71 5.1.2 european union declaration of conformity statement ................ 72 5.1.3 product ecology statements ................................................... 73 5.1.4 emc regulations ................................................................... 75 contents ix 5.1.5 energy star* 5.2, e - standby, and erp compliance ................. 78 5.1.6 regulatory compliance marks (board level) ............................. 79 5.2 battery disposal information .............................................................. 80 figures 1. major board components (top) .......................................................... 13 2. major board components (bottom) ..................................................... 15 3. block diagram .................................................................................. 17 4. memory channel and so - dim m configuration ...................................... 21 5. lan connector led locations ............................................................. 27 6. thermal solution and fan header ....................................................... 29 7. location of the standby power led ..................................................... 34 8. detailed system memory address map ................................................ 36 9. back panel connec tors ...................................................................... 38 10 . connectors and headers (bottom) ...................................................... 39 11 . connection diagram for front panel header ......................................... 44 12 . connection diagram for front panel usb 2.0 dual - port header ............... 45 13 . location of the bios configuration setup jumper ................................ . 46 14 . board dimensions ............................................................................. 48 15 . localized high temperature zones ..................................................... 51 tables 1. featur e summary ............................................................................. 11 2. components shown in figure 1 .......................................................... 14 3. components shown in figure 2 .......................................................... 16 4. supported memory configurations ...................................................... 19 5. lan connector led states ................................................................ . 27 6. effects of pressing the power switch ................................................... 30 7. power states and targeted system power ........................................... 31 8. wake - up devices and events ............................................................. 32 9. system memory map ........................................................................ 37 1 0 . connectors and headers shown in figure 10 ........................................ 40 11 . pci express full - mini card connect or .................................................. 41 12 . dual - port front panel usb 2.0 header ................................................. 42 13 . 19 v internal power supply connector ................................................ 43 14 . front panel header ........................................................................... 43 15 . states for a one - color power led ....................................................... 44 16 . bios setup configuration jumper settings .......................................... 47 17 . fan header current capability ............................................................ 50 18 . thermal considerations for components .............................................. 52 19 . tcontrol values for components ......................................................... 52 20 . environmental specifications .............................................................. 53 21 . accepdrives/medi a types for bios recovery ....................................... 58 22 . boot device menu options ................................................................ . 59 intel desktop board DCP847SKE technical product specification x 23 . master key and user hard drive password functions ............................ 60 24 . supervisor and user password functions ............................................. 61 25 . front - panel power led blink codes ..................................................... 63 26 . bios error messages ........................................................................ 63 27 . port 80h post code ranges .............................................................. 64 28 . port 80h post codes ........................................................................ 65 29 . typical port 80h post sequence ........................................................ 69 30 . safety standards .............................................................................. 71 31 . emc regulations ............................................................................... 75 32 . regulatory compliance marks ............................................................ 79 11 1 product description 1.1 overview 1.1.1 feature summary table 1 summarizes the major features of the board. table 1 . feature summary form factor 4.0 inches by 4.0 inches ( 101.60 millimeters by 101.60 millimeters) processor ? s oldered - down intel ? celeron ? processor 847 with up to 17 w tdp D i ntegrated graphics D i ntegrated memory con troller memory ? two 204- pin ddr3 sdram small outline dual inline memory module (so - dimm) sockets ? support for ddr3 1333 mhz and ddr3 1066 mhz so - dimms ? support for 1 gb , 2 gb , and 4 gb memory technology ? support for up to 16 gb of system memory with two so -d imms using 4 gb memory technology ? support for non - ecc memory ? support for 1.35 v low voltage jedec memory chipset intel ? qs77 express chipset consisting of the intel ? qs77 express platform controller hub (pch) graphics ? integrated graphics support for proc essors with intel ? graphics technology: D two high definition multimedia interface * ( hdmi *) back panel connectors audio intel ? h igh d efinition audio via the hdmi v1.4a interface s peripheral interfaces ? usb 2.0 ports: D three front panel ports (via one dual - po rt internal header and one front panel connector) D two ports are implemented with vertical back panel con nectors D one port is reserved for the pci express * half - mini card D one port is reserved for the pci express full - mini card ? sata port: D one internal msata port (pci express full - mini card ) for ssd support expansion capabilities ? one pci express half - mini card connector ? one pci express full - mini card connector bios ? intel ? bios resident in the serial peripheral interface ( spi ) flash device ? support for advanced configuration and power interface (acpi), plug and play, and system management bios ( smbios ) continued intel desktop board DCP847SKE technical product specification 12 table 1 . feature summary (continued) lan support gigabit (10/100/1000 mb/s) lan subsystem using the intel ? 82579v gigabit ethernet con troller hardware monitor subsystem hardware monitoring subsystem , based on a nuvoton npce791 c embedded controller , including: ? voltage sense to detect out of range power supply voltages ? thermal sense to detect out of range thermal values ? one processor fan header ? f an sense input used to monitor fan activity ? simple f an speed control product description 13 1.1.2 board layout (top) figure 1 shows the location of the major components on the top - side of intel next unit of computing board DCP847SKE . figure 1 . major board components (top) intel desktop board DCP847SKE technical product specification 14 table 2 lists the components identified in figure 1 . table 2 . components shown in figure 1 item from figure 1 description a battery b standby power led c processor f an header d onboard p ower button e power led f h ard disk d rive led g thermal solution product description 15 1.1.3 board layout (bottom) figure 2 shows the location of the major components on the bottom - side of intel next unit of computing board DCP847SKE . figure 2 . major board components (bottom) intel desktop board DCP847SKE technical product specification 16 table 3 . component s shown in figure 2 item from figure 2 description a back panel connectors b pci express full - mini card connector c pci express half - mini card connector d front panel dual - port usb 2.0 header e bios s etup configuration jumper f front panel usb 2.0 connector g front panel header h ddr3 so - dimm 2 socket i ddr3 so - dimm 1 socket j internal dc power connector product description 17 1.1.4 block diagram figure 3 is a block diagram of the major functional areas of the board. figure 3 . block diagram intel desktop board DCP847SKE technical product specification 18 1.2 online support to find information about visit this world wide web site: intel next unit of computing board DCP847SKE http://www.intel.com/products/motherboard/index.htm next unit of computing board support http://www.intel.com/p/en_us/support?iid=hdr+suppor t available configurations for intel next unit of computing board DCP847SKE http://ark.intel.com chipset information http://www.intel.com/products/desktop/chipsets/index.htm bios and driver updates http://downloadcenter.intel.com tested memory http://www.intel.com/support/motherboards/desktop/sb/cs - 025414.htm integration information http://www.intel.com/support/go/buildit 1.3 processor the board has a soldered - down intel celeron processor 847 with i ntegra ted g raphics technology and integrated memory controller. note product description 19 1.4 system memory the board has two 204 - pin so - dimm sockets and supports the following memory features: ? 1.5 v ddr3 sdram so - dimms with gold plated contacts ? support for 1.35 v low voltage ddr3 ( new jedec specification ) ? two independent memory channels with interleaved mode support ? unbuffered, single - sided or double - sided so - dimms ? 16 gb maximum total system memory (with 4 gb memory technology). refer to section 2.1.1 on page 35 for information on the total amount of addressable memory. ? minimum recommended total system memory: 1024 mb ? non - ecc so - dimms ? serial presence detect ? xmp profile support for voltage detection ? ddr3 1333 mhz and ddr3 1066 mhz sdram so - dimms no te table 4 lists the supported so - dimm configurations. table 4 . supported memory configurations so - dimm capacity configuration (note) sdram density sdram organization front - side/back - sid e number of sdram devices 1024 mb ss 1 gbit 128 m x8/empty 8 2048 mb ds 1 gbit 128 m x8/128 m x8 16 2048 mb ss 2 gbit 256 m x8/empty 8 4096 mb ds 2 gbit 256 m x8/256 m x8 16 4096 mb ss 4 gbit 512 m x8/empty 8 8192 mb ds 4 gbit 512 m x8/512 m x8 16 n ote: ?ds? refers to double - sided memory modules (containing two rows of sdram) and ?ss? refers to single - sided memory modules (containing one row of sdram). for information about refer to: tested memory http://support.intel.com/support/motherboards/desktop/sb /cs - 025414.htm intel desktop board DCP847SKE technical product specification 20 1.4.1 memory configurations the processor support s the following types o f memory organization: ? dual channel (interleaved) mode . this mode offers the highest throughput for real world applications. dual channel mode is enabled when the installed memory capacities of both so - dimm channels are equal. technology and device widt h can vary from one channel to the other but the installed memory capacity for each channel must be equal. if different speed so - dimm s are used between channels, the slowest memory timing will be used. ? single channel (asymmetric) mode . this mode is equiv alent to single channel bandwidth operation for real world applications. this mode is used when only a single so - dimm is installed or the memory capacities are unequal. technology and device width can vary from one channel to the other. if different spe ed so - dimm s are used between channels, the slowest memory timing will be used. for information about refer to: memory configuration examples http://www.intel.com/support/motherboards/desktop/sb/cs - 011965.htm product description 21 figure 4 illustrates the memory channel and so - dimm configuration. figure 4 . memory channel and so- dimm configuration intel desktop board DCP847SKE technical product specification 22 1.5 intel ? qs77 express chipset intel qs77 ex press chipset with direct media interface (dmi) interconnect provides interfaces to the processor and the usb , sata , lpc, lan , and pci express interfaces . the intel qs77 express chipset is a centralized controller for the board?s i/o paths. for informati on about refer to the intel qs77 chipset http://www.intel.com/products/desktop/chipsets/index.htm resources used by the chipset chapter 2 1.5.1 direct media interface (dmi) direct media interface (dmi) is the chip - to - chip connection between the processor an d pch. this high - speed interface integrates advanced priority - based servicing allowing for concurrent traffic and true isochronous transfer capabilities. 1.5.2 display interfaces display is divided between the processor and the pch. the processor houses the memo ry interface, display planes, and pipes while the pch has transcoder and display interface or ports. the pch receives the display data over intel ? flexible display interface ( intel ? fdi ) and transcodes the data as per the display technology protocol and se nds the data through the display interface. 1.5.2.1 intel ? flexible display interconnect (intel ? fdi) intel fdi connects the display engine in the processor with the display interfaces on the pch. the display data from the frame buffer is processed in the display engine of the processor and sent to the pch over the intel fdi where it is transcoded as per the display protocol and driven to the display monitor. 1.5.2.2 high - bandwidth digital content protection (hdcp) hdcp is the technology for protecting high definition cont ent against unauthorized copy or unreceptive between a source (computer, digital set top boxes, etc.) and the sink (panels, monitor, and tvs). the pch supports hdcp 1.4 for content protection over wired displays (hdmi). 1.6 graphics subsystem the board supports graphics through intel graphics technology . 1.6.1 integrated graphics the board supports integrated graphics through intel fdi . product description 23 1.6.1.1 intel ? high definition (intel ? hd) graphics the intel hd graphics controller features the following: ? 3d features ? directx * 10.1 and opengl * 3.0 compliant ? directx 11.0 cs4.0 only ? shader model 4.0 ? video ? hi gh - definition content at up to 1080p resolution ? hardware accelerated mpeg - 2, vc - 1/wmv and h.264/avc hi - definition video formats ? intel hd technology with advanced hardware video transco ding ? blu - ray * s3d via hdmi 1.4 a ? dynamic video memory technology (dvmt) 5.0 support ? support of up to 1.7 gb video memory with 4 gb and above system memory configuration 1.6.1.2 video memory allocation intel ? dynamic video memory technology (dvmt) is a method for dy namically allocating system memory for use as graphics memory to balance 2d/3d graphics and system performance. if your computer is configured to use dvmt, graphics memory is allocated based on system requirements and application demands (up to the configu red maximum amount). when memory is no longer needed by an application, the dynamically allocated portion of memory is returned to the operating system for other uses. 1.6.1.3 high definition multimedia interface* (hdmi*) the two hdmi port s support standard, enhanced, or high definition video, plus multi - channel digital audio on a single cable. each port is compatible with all atsc and dvb hdtv standards and support s eight full range channels at 24 - bit/96 khz audio of lossless audio formats such as dolby* truehd o r dts* hd master audio. the maximum supported resolution is 1920 x 1200 (wuxga). the hdmi port is compliant with the hdmi 1. 4a specification. 1.6.1.3.1 integrated audio provided by the hdmi interfaces the following audio technologies are supported by the hdmi 1.4a interfaces directly from the pch: ? ac - 3 - dolby* digital ? dolby digital plus ? dts - hd* ? lpcm, 192 khz/24 - bit, 8 channel ? note intel desktop board DCP847SKE technical product specification 24 1.6.2 usb the board supports seven usb 2 .0 ports . the port arrangement is as follows: ? three front panel ports (via one dual - port internal header and one front panel connector) ? two ports are implemented with ver t ical back panel con nectors ? one port is reserved for the pci express half - mini card ? o ne port is reserved for the pci express full - mini card all seven usb 2.0 ports are high - speed, full - speed, and low - speed capable. note for information about refer to the location of the usb connectors on the back panel figure 9 , page 38 the location of the front panel usb headers figure 2 , page 15 1.7 sata interface the board provides o ne internal m sata port ( pci express full - mini card connector ) for ssd support. the pch provides independent sata ports with a theoretical maximum transfer rate of 6 gb/s. a point - to - point interface is used for host to device connections. the underlying sata functionality is transparent to the operating system. the sata controller can oper ate in both legacy and native modes. in legacy mode, standard ide i/o and irq resources are assigned (irq 14 and 15). in native mode, standard pci conventional bus resource steering is used. native mode is the preferred mode for configurations using win dows operating systems. 1.7.1 ahci mode the board supports ahci storage mode via the intel qs77 express chipset . note product description 25 1.8 real - time clock subsystem a coin - cell battery (cr2032) powers the real - time clock and cmos memory. when the computer is not plugged into a wall socket, the battery has an estimated life of three years. when the computer is plugged in, the standby current from the power supply extends the life of the battery. the clock is accurate to 13 minutes/year at 25 oc with 3.3 vsb applied v ia the power supply 5 v stby rail . note when the voltage drops below a certain level, the bios setup program settings stored in cmos ram ( for example, the date and time) might not be accurate. replace the battery with an equivalent one. figure 1 on page 13 shows the location of the battery. 1.9 lan subsystem the lan subsystem consists of the following: ? intel 82579v gigabit ethernet controller (10/100/1000 mb/s) ? intel qs77 express chipset ? rj - 45 lan connector with integrated status leds additional features of the lan subsystem include: ? csma/cd protocol engine ? jumbo frame support ? lan connect interface between the pch and the lan controller ? p ower management capabilities ? acpi technology support ? lan wake capabilities ? lan subsystem software for information about refer to lan software and drivers h ttp://downloadcenter.intel.com intel desktop board DCP847SKE technical product specification 26 1.9.1 intel ? 82579v gigabit ethernet controller the intel 8257 9v gigabit ethernet controller supports the following features: ? 10/100/1000 base - t ieee 802.3 compliant ? energy efficient ethernet (eee) ieee802.3az support ( low powe r idle (lpi) mode ) ? dual interconnect between the integrated lan controller and the physical layer (phy): ? pci express - based interface for active state operation (s0) state ? smbus for host and management traffic (sx low power state) ? compliant to ieee 802.3x f low control support ? 802.1p and 802.1q ? tcp, ip, and udp checksum offload (for ipv4 and ipv6) ? full device driver compatibility 1.9.2 lan subsystem software lan software and drivers are available from intel?s world wide web site. for information about refer to obtaining lan software and drivers http://downloadcenter.intel.com product description 27 1.9.3 rj - 45 lan connector with integrated leds two leds are built into the rj - 45 lan connector (shown in figure 5 ). item description a link led (green) b data rate led (green/yellow) figure 5 . lan connector led locations table 5 describes the led states when the board is powered up and th e lan subsystem is operating. table 5 . lan connector led states led led color led state condition link green off lan link is not established. on lan link is established. blinking lan activity is occurring. data rate green/y ellow off 10 mb/s data rate is selected. green 100 mb/s data rate is selected. yellow 1000 mb/s data rate is selected. intel desktop board DCP847SKE technical product specification 28 1.10 hardware management subsystem the hardware management features enable the board to be compatible with the wired for management (wfm) specification. the board has several hardware management features, including t hermal and voltage monitoring . for information about refer to wired for management (wfm) specification www.intel.com/design/archives/wfm/ 1.10.1 hardware monitoring the hardware monitoring and fan control subsystem is based on a nuvoton npce791c embedded controller , which supports the following: ? processor and system ambient temperature monitoring ? chassis fan speed monito ring ? voltage monitoring of +12 v, +5 v, +3.3 v, memory vcc ( v _sm ) , +vccp , p ch vcc ? smbus interface 1.10.2 fan monitoring fan monitoring can be implemented using third - party software. product description 29 1.10.3 thermal solution figure 6 shows the location of th e thermal solution and processor fan header. item description a processor f an header b thermal solution figure 6 . thermal solution and fan header intel desktop board DCP847SKE technical product specification 30 1.11 power management power management is implemented at several levels, including: ? software support through advanced configuration and power interface (acpi) ? hardware support: ? power input ? instantly available pc technology ? lan wake capabilities ? wake from usb ? wake# signal wake - up support ? wake from s5 ? +5 v standby power indicator led 1.11.1 acpi acpi gives the operating system direct control over the power management and plug and play functions of a computer. the use of acpi with this board requires an operating system that provides full acpi support. acpi features include: ? plug and play (inclu ding bus and device enumeration) ? power management control of individual devices, add - in boards (some add - in boards may require an acpi - aware driver), video displays, and hard disk drives ? methods for achieving less than 15 - watt system operation in the power - on/standby sleeping state ? a soft - off feature that enables the operating system to power - off the computer ? support for multiple wake - up events (see table 8 on page 32 ) ? support for a fro nt panel power and sleep mode switch table 6 lists the system states based on how long the power switch is pressed, depending on how acpi is configured with an acpi - aware operating system. table 6 . effects of pressing the power switch if the system is in this state and the power switch is pressed for the system enters this state off (acpi g2/g5 ? soft off) less than four seconds power - on (acpi g0 ? working state) on (acpi g0 ? working state) less than four seconds soft - off/standby (acpi g1 ? sleeping state) note on (acpi g0 ? working state) more than six seconds fail safe power - off (acpi g2/g5 ? soft off) sleep (acpi g1 ? sleeping state) less than four seconds wake - up (acpi g0 ? working state) sleep (acpi g1 ? sleeping state) more than six seconds power - off (acpi g2/g5 ? soft off) note: d epending on power management settings in the operating system. product description 31 1.11.1.1 system states and power states under acpi, the operating system directs all system and device power state transitions. the operating system puts devices in and out of low - power states based on user preferences and knowledge of how devices are being used by applications. devices that are not being used can be turned off. the operating system uses info rmation from applications and user settings to put the system as a whole into a low - power state. table 7 lists the power states supported by the board along with the associated system power targets. see the acpi specification for a complete description of the various system and power states. table 7 . power states and targeted system power global states sleeping states processor states device states targeted system power (note 1) g0 ? w orking state s0 ? working c0 ? working d0 ? working state. full power > 30 w g1 ? sleeping state s3 ? suspend to ram. context saved to ram. no power d3 ? no power except for wake - up logic. power < 5 w (note 2) g1 ? sleeping state s4 ? suspend to disk. context saved to disk. no power d3 ? no power except for wake - up logic. power < 5 w (note 2) g2/s5 s5 ? soft off. context not saved. cold boot is required. no power d3 ? no power except for wake - up logic. power < 5 w (note 2) g3 ? mechanical off ac power is disconnected from the computer. no power to the system. no power d3 ? no power for wake - up logic, except when provided by battery or external source. no power to the system. service can be performed safely. notes: 1. total system power is dependent on the system configuration, including add - in boards and peripherals powered by the system chassis? power supply. 2. dependent on the standby power consumption of wake - up devices used in the system. intel desktop board DCP847SKE technical product specification 32 1.11.1.2 wake - up devices and events table 8 lists the devices or specific events that can wake the computer from specific states. table 8 . wake - up devices and events devices/events that wake up the system from this sleep state from this global state pow er switch s3, s4, s5 ( note 1) g1, g2, g3 rtc alarm s3, s4, s5 (note 1) g1 , g2 (note 3) lan s3, s4, s5 (note 1) g1, g2 (note 3) usb s3 g1 wake# s3, s4, s5 (note 1) g1, g2 (note 3) notes: 1. s4 implies operating system support only. 2. wake from s4 and s5 i s recommended by microsoft. 3. wake from device/event not supported immediately upon return from ac loss . note 1.11.2 hardware support the board provides several power management hardware features, including: ? wake from power button signal ? instantly available pc technology ? lan wake capabilities ? wake from usb ? wake# signal wake - up support ? wake from s5 ? +5 v standby power indicator led note product description 33 1.11.2.1 power input when resuming from an ac power failure, the computer returns to the power state it was in before power was interrupted (on or off). the computer?s response can be set using the last power state feature in the bios setup program?s boot menu. for information about refer to the location of the internal power connector figure 2 , page 15 the signal names of the internal power connector table 13 , page 43 1.11.2.2 instantly available pc technology instantly available pc t echnology enables the board to enter the acpi s3 (suspend - to - ram) sleep - state. while in the s3 sleep - state, the computer will appear to be off (the power supply is off, and the front panel led is amber if dual colored, or off if single colored.) when sig naled by a wake - up device or event, the system quickly returns to its last known wake state. table 8 on page 32 lists the devices and events that can wake the computer from the s3 sta te. the use of instantly available pc technology requires operating system support and drivers for any installed pci express add - in card. 1.11.2.3 lan wake capabilities lan wake capabilities enable remote wake - up of the computer through a network. the lan subsyste m monitors network traffic at the media independent interface. upon detecting a magic packet* frame, the lan subsystem asserts a wake - up signal that powers up the computer. 1.11.2.4 wake from usb usb bus activity wakes the computer from an acpi s3 state. note 1.11.2.5 wake# signal wake - up support when the wake# signal on the pci express bus is asserted, the computer wakes from an acpi s3, s4, or s5 state. 1.11.2.6 wake from s5 when the rtc date and t ime is set in the bios, the computer will automatically wake from an acpi s5 state. intel desktop board DCP847SKE technical product specification 34 1.11.2.7 +5 v standby power indicator led the standby power indicator led shows that power is still present even when the computer appears to be off . figure 7 shows the location of the standby power led. caution figure 7 . location of the standby power led 35 2 technical reference 2.1 memory resources 2.1.1 addressable memory the board utilizes 16 gb of addressable system memory. typically the address space that is allocated for pci conventional bus add - in cards, pci express configuration space, bios (spi flash device), and chipset overhead resides above the top of dram (total system memory). on a system that has 16 gb of system memory installed, it is not possi ble to use all of the installed memory due to system address space being allocated for other system critical functions. these functions include the following: ? bios/spi flash device (16 mbit) ? local apic (19 mb) ? direct media interface (40 mb) ? pci express co nfiguration space (256 mb) ? pch base address registers pci express ports (up to 256 mb) ? memory - mapped i/o that is dynamically allocated for pci express add - in cards (256 mb) the board provides the capability to reclaim the physical memory overlapped by the memory mapped i/o logical address space. the board remaps physical memory from the top of usable dram boundary to the 4 gb boundary to an equivalent sized logical address range located just above the 4 gb boundary. figure 8 shows a schematic of the system memory map. all installed system memory can be used when there is no overlap of system addresses. intel desktop board DCP847SKE technical product specification 36 figure 8 . detailed system memory address map technical reference 37 2.1.2 memory map table 9 lists the system memory map. table 9 . system memory map address range (decimal) address range (hex) size description 1024 k - 16777216 k 100000 ? 400000000 16382 mb extended memory 960 k - 1024 k f0000 - fffff 64 kb runtime b ios 896 k - 960 k e0000 - effff 64 kb reserved 800 k - 896 k c8000 - dffff 96 kb potential available high dos memory (open to the pci conventional bus). dependent on video adapter used. 640 k - 800 k a0000 - c7fff 160 kb video memory and bios 639 k - 640 k 9fc00 - 9ffff 1 kb extended bios data (movable by memory manager software) 512 k - 639 k 80000 - 9fbff 127 kb extended conventional memory 0 k - 512 k 00000 - 7ffff 512 kb conventional memory 2.2 connectors and headers caution this section describes the board?s connectors and headers. the connectors and headers can be divided into these group s: ? back panel i/o connectors ? on - board i/o connectors and headers (see page 39 ) intel desktop board DCP847SKE technical product specification 38 2.2.1 back panel connectors figure 9 shows the location of the back panel connectors for the board. item description a lan b hdmi connector 2 c hdmi connector 1 d usb 2.0 port e usb 2.0 port f 19 v dc input jack figure 9 . back panel connectors technical reference 39 2.2.2 connectors and headers (bottom ) figure 10 shows the locations of the connect ors and headers on the bottom - side of the board. figure 10 . connectors and headers (bottom) intel desktop board DCP847SKE technical product specification 40 table 10 lists the connectors and headers identified in figure 10 . table 10 . connectors and headers shown in figure 10 item from figure 10 description a pci express full - mini card connector b pci express half - mini card connector c front panel dual - port usb 2.0 header d front panel header e internal dc power connector technical reference 41 2.2.2.1 signal tables for the connectors and headers table 11 . pci express full - mini card connector pin signal name additional signal name 1 wake# 2 3.3 v 3 reserved (extra usb) +5 v_mini 4 gnd 5 reserved (extra usb) cardin 6 1.5 v 7 clkreq# 8 reserved 9 gnd 10 reserved 11 refclk - 12 reserved 13 refclk+ 14 reserved 15 gnd 16 reserved 17 reserved (extra usb) l p5 - 18 gnd 19 reserved (extra usb) lp5+ 20 reserved 21 gnd 22 perst# 23 pern0 24 +3.3 v aux 25 perp0 26 gnd 27 gnd 28 +1.5 v 29 gnd 30 smb_clk 31 petn0 32 smb_data 33 petp0 34 gnd 35 gnd 36 usb_d - 37 gnd 38 usb_d+ continued intel desktop board DCP847SKE technical product specification 42 table 11 . pci express full - mini card connector (continued) pin signal name additional signal name 39 +3.3 vaux 40 gnd 41 +3.3 vaux 42 led_wwan# 43 reserved 44 led_wlan# 45 reserved (msata) vend or 46 led_wpan# 47 reserved (msata) vendor 48 +1.5v 49 reserved (msata) da/dss 50 gnd 51 reserved (msata) presence detection 52 +3.3v table 12 . dual- port front panel usb 2.0 header pin signal name pin signal name 1 +5 v dc 2 +5 v dc 3 d? 4 d? 5 d+ 6 d+ 7 ground 8 ground 9 key (no pin) 10 no connect 2.2.2.2 add - in card connector s the board has the following add - in card connectors: ? one pci express half - mini card ? one pci express full - mini card technical reference 43 2.2.2.3 power supply connector s the board has the following power supply connectors: ? external power supply ? the board can be powered through a 19 v dc connector on the back panel. the back panel dc connector is compatible with a 5.5 mm/od (outer diameter) and 2.5 mm/id ( inner diamete r) plug , where the inner contact is +19 ( 10 %) v dc and the shell is gnd. the maximum current rating is 1 0 a. ? internal power supply ? the board can alternatively be powered via the internal 19 v dc 1 x 2 power connector, where pin 1 is gnd and pin 2 is + 19 (10%) vdc. table 13 . 19 v internal power supply connector pin signal name 1 ground 2 + 19 v (10%) for information about refer to power supply considerations section 2.5.1 , page 49 2.2.2.4 front panel header this section describes the functions of the front panel header. table 14 lists the signal names of the front panel header. figure 11 i s a connection diagram for the front panel header. table 14 . front panel header pin signal name description pin signal name description 1 hdd_power_led pull - up resistor (750 ) to +5v 2 power_led_main [out] front panel led (main c olor) 3 hdd_led# [out] hard disk activity led 4 power_led_alt [out] front panel led (alt color) 5 ground ground 6 power_switch# [in] power switch 7 reset_switch# [in] reset switch 8 ground ground 9 +5v_dc power 10 key no pin intel desktop board DCP847SKE technical product specification 44 figure 11 . connection diagram for front panel header 2.2.2.4.1 hard drive activity led header pins 1 and 3 can be connected to an led to provide a visual indicator that data is being read from or written to a hard drive. proper led function requires a sata hard drive or optical drive connected to an onboard sata connector . 2.2.2.4.2 reset switch header pins 5 and 7 can be connected to a momentary single pole, single throw (spst) type switch that is normally open. when the switch is closed, the board resets and runs the p ost. 2.2.2.4.3 power/sleep led header pins 2 and 4 can be connected to a one - or two - color led. table 15 shows the possible led states. table 15 . states for a one - color power led led state description off power off blinking standby steady normal operation note technical reference 45 2.2.2.4.4 power switch header pins 6 and 8 can be connected to a fro nt panel momentary - contact power switch. the switch must pull the sw_on# pin to ground for at least 50 ms to signal the power supply to switch on or off. (the time requirement is due to internal debounce circuitry on the board.) at least two seconds mus t pass before the power supply will recognize another on/off signal. 2.2.2.5 front panel usb 2.0 header figure 12 is a connection diagram for the front panel usb 2.0 header. note ? ? figure 12 . connection diagram for front panel usb 2.0 dual - port header intel desktop board DCP847SKE technical product specification 46 2.3 bios setup configuration jumper caution figure 13 shows the location of the bios setup config uration jumper . table 16 describes the bios setup configuration jumper settings for the three modes: normal, configure, and recovery. when the jumper is set to configure mode and the computer is powered - up, the bios compares the processor version and the microcode version in the bios and reports if the two match. figure 13 . location of the bios configuration setup jumper technical reference 47 table 16 list s the settings for the jumper. table 16 . bios setup configuration jumper settings function/mode jumper setting configuration normal 1-2 the bios uses current configuration information and passwords for booting. configure 2-3 after the post runs, setup runs automatically. the maintenance menu is displayed. note that this configure mode is the only way to clear the bios/cmos settings. press f9 (restore defaults) while in configure mode to restore the bios/cmos settings to their default values. recovery none the bios attempts to recover the bios configuration. a recovery cd or flash drive is required. intel desktop board DCP847SKE technical product specification 48 2.4 mechanical considerations 2.4.1 form factor the board is designed to fit into a custom chassis. figure 14 illustrates the me chanical form factor for the board. dimensions are given in inches [millimeters]. the outer dimensions are 4.0 inches by 4.0 inches [ 101.60 millimeters by 101.60 millimeters]. figure 14 . board dimensions technical reference 49 2.5 electrical conside rations 2.5.1 power supply considerations caution the internal 1 x 2 power connector is a molex 5566 - 2 header which accepts a molex 5557 - 02r connector from the power supply. there is no isolation circuitry between the external 19 v dc jack and the interna l 1 x 2 power connector. it is the system integrator?s responsibility to ensure no more than one power supply unit is or can be attached to the board at any time and to ensure the external 19 v dc jack is covered if the internal 1 x 2 power connector is to be used. simultaneous connection of both external and internal power supply units could result in potential damage to the board, power supplies, or other hardware. system power requirements will depend on actual system configurations chosen by the int egrator, as well as end user expansion preferences. it is the system integrator?s responsibility to ensure an appropriate power budget for the system configuration is properly assessed based on the system - level components chosen. intel desktop board DCP847SKE technical product specification 50 2.5.2 fan header current c apability table 17 lists the current capability of the fan headers. table 17 . fan header current capability fan header maximum available current processor fan .1 a 2.6 thermal consideration s caution o c at the processor fan inlet is a requirement. whenever possible, use of a processor heat sink that provides omni - directional airflow to maintain required airflow across the processor voltage regulator area is recommended . caution caution caution o c in an open chassis. ensure that pro per airflow is maintained in the processor voltage regulator circuit. failure to do so may result in shorter than expected product lifetime. technical reference 51 figure 15 shows the locations of the localized high temperature zones. item description a processor voltage regulator area b thermal solution figure 15 . localized high temperature zones intel desktop board DCP847SKE technical product specification 52 table 18 provides maximum case temperatures for the components that are sensitive to thermal changes. the operating temperature, current load, or operating frequency could affect case temperatures. maximum case temperatures are important when considering proper airflow to cool the board. table 18 . thermal considerations for components component maximum case temperature processor for processor case temperature, see processor datasheets and processor specification updates intel qs77 express chipset 104 o c to ensure functionality and reliabilit y, the component is specified for proper operation when case temperature is maintained at or below the maximum temperature listed in table 19 . this is a requirement for sustained power dissipation equal to thermal design power (td p is specified as the maximum sustainable power to be dissipated by the components). when the component is dissipating less than tdp, the case temperature should be below the maximum case temperature. the surface temperature at the geometric center of the component corresponds to case temperature. it is important to note that the temperature measurement in the system bios is a value reported by embedded thermal sensors in the components and does not directly correspond to the maximum case temperature. the u pper operating limit when monitoring this thermal sensor is tcontrol. table 19. tcontrol values for components component tcontrol processor for processor case temperature, see processor datasheets and processor specification upda tes intel qs77 express chipset 104 o c for information about refer to processor datasheets and specification updates section 1.2 , page 18 intel ? 7 series chipset thermal mechanical specifications and design guidelines http://www.intel.com/products/desktop/ chipsets/ec - qs77 / qs77 - technicaldocuments.htm technical reference 53 2.7 reliability the mean time between failures (mtbf ) prediction is calculated using component and subassembly random failure rates. the calculation is based on the telcordia sr - 332 issue 2, method i, case 3, 55 oc ambient. the mtbf prediction is used to estimate repair rates and spare parts requirements. the mtbf for the board is 90,936 hours. 2.8 environmental table 20 lists the environmental specifications for the board. table 20 . environmental specifications parameter specification temper ature non - operating -4 0 c to + 6 0 c operating 0 c to +5 0 c shock unpackaged 50 g trapezoidal waveform velocity change of 170 inches/s2 packaged half sine 2 millisecond product weight (pounds) free fall (inches) velocity change (inches/s2 ) <20 36 167 21- 40 30 152 41- 80 24 136 81- 100 18 118 vibration unpackaged 5 hz to 20 hz: 0.01 g2 hz sloping up to 0.02 g2 hz 20 hz to 500 hz: 0.02 g2 hz (flat) packaged 5 hz to 40 hz: 0.015 g2 hz (flat) 40 hz to 500 hz: 0.015 g2 hz sloping down to 0.00015 g2 hz intel desktop board DCP847SKE technical product specification 54 55 3 overview of bios features 3.1 introduction the board uses a intel visual bios that is stored in the serial peripheral interface flash memory (spi flash) and can be updated using a disk - based program. the spi flash contains the visual bios setup program, post, the pci auto - configuration utility, lan eeprom information, and plug and play support. the bios displays a message during post identifying the type of bios and a revision code. the initial production bioss are identified as gkppt10h.86a . when the bios setup configuration jumper is set to configure mode and the computer is powered - up, the bios compares the cpu version and the microcode version in the bios and reports if the two match. the visual bios setup program can be used to view and change the bios settings for the computer. the bios setup program is accessed by pressing the intel desktop board DCP847SKE technical product specification 56 3.2 bios flash memory organization the serial peripheral interface flash memory (spi flash) includes a 64 mb ( 8192 kb) flash memory device. 3.3 system management bios (smbios) smbios is a desktop management interface (dmi) compliant method for managing computers in a managed network. the main component of smbios is the management informatio n format (mif) database, which contains information about the computing system and its components. using smbios, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components. the mif d atabase defines the data and provides the method for accessing this information. the bios enables applications such as third - party management software to use smbios. the bios stores and reports the following smbios information: ? bios data, such as the bio s revision level ? fixed - system data, such as peripherals, serial numbers, and asset tags ? resource data, such as memory size, cache size, and processor speed ? dynamic data, such as event detection and error logging non - plug and play operating systems require an additional interface for obtaining the smbios information. the bios supports an smbios table interface for such operating systems. using this support, an smbios service - level application running on a non - plug and play operating system can obtain the s mbios information. additional board information can be found in the bios under the additional information header under the main bios page. 3.4 legacy usb support legacy usb support enables usb devices to be used even when the operating system?s usb drivers ar e not yet available. legacy usb support is used to access the bios setup program, and to install an operating system that supports usb. by default, legacy usb support is set to enabled. legacy usb support operates as follows: 1. when you apply power to the computer, legacy support is disabled. 2. post begins. 3. legacy usb support is enabled by the bios allowing you to use a usb keyboard to enter and configure the bios setup program and the maintenance menu. 4. post completes. 5. the operating system loads. while the o perating system is loading, usb keyboards and mice are recognized and may be used to configure the operating system. (keyboards and mice are not recognized during this period if legacy usb support was set to disabled in the bios setup program.) error messages and beep codes 57 6. after the operating system loads the usb drivers, all legacy and non - legacy usb devices are recognized by the operating system, and legacy usb support from the bios is no longer used. 7. additional usb legacy feature options can be access by using intel ? integrator too lkit. to install an operating system that supports usb, verify that legacy usb support in the bios setup program is set to enabled and follow the operating system?s installation instructions. 3.5 bios updates the bios can be updated using either of the follo wing utilities, which are available on the intel world wide web site: ? intel ? express bios update utility, which enables automated updating while in the windows environment. using this utility, the bios can be updated from a file on a hard disk, a usb driv e (a flash drive or a usb hard drive), or a cd - rom, or from the file location on the web. ? intel ? flash memory update utility, which requires booting from dos. using this utility, the bios can be updated from a file on a hard disk, a usb drive (a flash dri ve or a usb hard drive), or a cd - rom. ? intel ? f7 switch during post allows a user to select where the bios .bio file is located and perform the update from that location/device. similar to performing a bios recovery without removing the bios configuration j umper. both utilities verify that the updated bios matches the target system to prevent accidentally installing an incompatible bios. note for information abou t refer to bios update utilities http://support.intel.com/support/motherboards/desktop/sb /cs - 022312.htm 3.5.1 language support the bios setup program and help messages are supported in us english. check the intel web site for support. intel desktop board DCP847SKE technical product specification 58 3.5.2 custom splash screen during post, an intel ? splash screen is displayed by default. this splash screen can be augmented with a custom splash screen. the intel integrator?s toolkit that is available from intel can be used to create a custom splash screen. note for information about refer to intel integrator toolkit http://developer.intel.com/design/motherbd/software/itk/ additional intel ? software tools http://developer.intel.com/design/motherbd/software.htm 3.6 bios recovery it is unlikely that anything will interrupt a bios update; however, if an interruption occurs, the bios could be damaged. table 21 lists the drives and media types that can and cannot be used for bios recovery. the bios recovery media does not need to be made bootable. table 21 . acceptable drives/media types for bios recovery media type (note) can be used for bios recovery? hard disk drive ( connected to sata or usb) yes cd/dvd drive ( connected to sata or usb) yes usb flash drive yes usb diskette drive (with a 1.4 mb diskette) no (bios update file is bigger than 1.4 mb size limit) note ? ? ? ? ? for information about refer to bios recovery http://www.intel.com/support/motherboards/desktop/sb/cs - 023360.htm error messages and beep codes 59 3.7 boot options in the bios setup program, the user can choose to boot from a hard drive, optical drive, removable drive, or the network. the default setting is for the optical drive to be the first boot device, the har d drive second, removable drive third, and the network fourth. 3.7.1 network boot the network can be selected as a boot device. this selection allows booting from the onboard lan or a network add - in card with a remote boot rom installed. pressing the intel desktop board DCP847SKE technical product specification 60 3.8 hard disk drive p assword security feature the hard disk drive password security feature blocks read and write accesses to the hard disk drive until the correct password is given. hard disk drive passwords are set in bios setup and are prompted for during bios post. for convenient support of s3 resume, the system bios will automatically unlock drives on resume from s3. the user hard disk drive password , when installed , will be required upon each power - cycle until the master key or user hard disk drive password is submitted. the master key hard disk drive password , when installed , will not lock the drive. the master key hard disk drive password exists as an unlock override in the event that the user hard disk drive password is forgotten. only the installation of the user hard disk drive password will cause a hard disk to be locked upon a system power - cycle. table 23 shows the effects of setting the hard disk drive passwords. table 23 . master key and user hard drive password fu nctions password set password during boot neither none master only none user only user only master and user set master or user during every post, if a user hard disk drive password is set , post execution will pause with the following prompt to force the user to enter the master key or user hard disk drive password : enter hard disk drive password: upon successful entry of the master key or user hard disk drive password, the system will continue with normal post. if the hard disk drive password is no t correctly entered, the system will go back to the above prompt. the user will have three attempts to correctly enter the hard disk drive password. after the third unsuccessful hard disk drive password attempt, the system will halt with the message: hard disk drive password entry error a manual power cycle will be required to resume system operation. note error messages and beep codes 61 3.9 bios security features the bios includes security features that restrict access to the bios setup program and wh o can boot the computer. a supervisor password and a user password can be set for the bios setup program and for booting the computer, with the following restrictions: ? the supervisor password gives unrestricted access to view and change all the setup opti ons in the bios setup program. this is the supervisor mode. ? the user password gives restricted access to view and change setup options in the bios setup program. this is the user mode. ? if only the supervisor password is set, pressing the intel desktop board DCP847SKE technical product specification 62 63 4 error messages and blink codes 4.1 front - panel power led blink codes whenever a recoverable error occurs during post, the bios causes the board?s front panel power led to blink an error message describing the problem (see table 25 ). table 25 . front - panel power led blink codes type pattern note bios update in progress off when the update begins, then on for 0.5 seconds, then off for 0.5 seconds. the pattern repeats until the bios update is complete. video error (note) on - off ( 1.0 second each) two times, then 2.5 - second pause (off), entire pattern repeats (blink and pause) until the system is powered off. when no vga option rom is found. memory error on - off (1.0 second each) three times, then 2.5 - second pause (off), entire patt ern repeats (blinks and pause) until the system is powered off. thermal trip warning each beep will be accompanied by the following blink pattern: .25 s econds on, .25 s econds o ff , .25 s econds on , .25 s econds o ff. this will result in a total of 16 blinks. note: disabled per default bios setup option. 4.2 bios error messages table 26 lists the error messages and provides a brief description of each. table 26 . bios error messages error message explanation cmos battery low the battery may be losing power. replace the battery soon. cmos checksum bad the cmos checksum is incorrect. cmos memory may have been corrupted. run setup to reset values. memory size decreased memory size has decreased since the last boot. if no memory was removed, then memory may be bad. no boot device available system did not find a device to boot. intel desktop board DCP847SKE technical product specification 64 4.3 port 80h post codes during the post, the bios generates diagnostic progress codes (post codes) to i/o port 80h. if the post fails, execution stops and the last post code generated is left at port 80h. this code is useful for determining the point where an error occurred. displaying the post codes requires a post card that can interface with the debug header. refer to the location of the debug header in figure 1 . the following tables provide information about the post codes generated by the bios: ? table 27 lists the port 80h post code ranges ? table 28 lists the port 80h post codes themselves ? table 29 lists the port 80h post sequence note t able 27 . port 80h post code ranges range subsystem 0x00 ? 0x05 entering sx states s0 to s5. 0x10, 0x20, 0x30, 0x40, 0x50 resuming from sx states ( 0x10 ? 0x20 ? s2, 0x30 ? s3, etc. ) 0x01 ? 0x0f security (sec) phase 0x11 ? 0x1f pei phase pre mrc execution 0x21 ? 0x29 mrc memory detection 0x 2a ? 0x2f pei phase post mrc execution 0x31 ? 0x35 recovery 0x36 ? 0x3f platform dxe driver 0x41 ? 0x4f cpu initialization (pei, dxe, smm) 0x50 ? 0x5f i/o buses: pci, usb, ata etc. 0x5f is an unrecoverable error. start with pci. 0x60 ? 0x6f bds 0x70 ? 0x7f output devices: all output consoles. 0x80 ? 0x8f for future use 0x90 ? 0x9f input devices: keyboard/mouse. 0x a0 ? 0x af for future use 0x b0 ? 0x bf boot devices: includes fixed media and removable media. not that critical since consoles should be up at this point. 0x c0 ? 0x cf for future use 0xd0 ? 0xdf for future use error messages and beep codes 65 table 28 . port 80h post codes port 80 code progress code enumeration acpi s st ates 0x00,0x01,0x02,0x03,0x04,0x05 entering s0, s2, s3, s4, or s5 state 0x10,0x20,0x30,0x40,0x50 resuming from s2, s3, s4, or s5 state security phase (sec) 0x08 starting bios execution after cpu bist 0x09 spi prefetching and caching 0x0a load bsp microcode 0x0b load aps microcode 0x0c platform program baseaddresses 0x0d wake up all aps 0x0e initialize nem 0x0f pass entry point of the pei core pei before mrc pei platform driver 0x11 set bootmode, gpio init 0x12 early chipset register programming including graphics init 0x13 basic pch init, discrete device init ( ieee 1394, sata) 0x14 lan init 0x15 exit early platform init driver pei smbus 0x16 smbusriver init 0x17 entry to smbus execute read/write 0x18 exit smbus execute read/write memory 0x21 mrc entry point 0x2 2 reading spd from memory dimms 0x2 3 detecting presence of memory dimms 0x2 5 configuring memory 0x28 testing memory 0x29 exit mrc driver pei after mrc 0x2a start to program mtrr settings 0x2b done programming mtrr settings continued intel desktop board DCP847SKE technical product specification 66 table 28 . port 80h post codes (continued) port 80 c ode progress code enumeration peims/recovery 0x31 crisis recovery has initiated 0x3 4 loading recovery capsule 0x3 5 start recovery capsule / valid capsule is fou nd cpu initialization cpu pei phase 0x41 begin cpu pei init 0x42 xmm instruction enabling 0x43 end cpu pei init cpu pei smm phase 0x44 begin cpu smm init smm relocate bases 0x45 smm relocate bases for aps 0x46 end cpu smm init cpu dxe phase 0x47 cpu dxe phase begin 0x48 refresh memory space attributes according to mtrrs 0x49 load the microcode if needed 0x4a initialize strings to hii database 0x4b initialize mp support 0x4c cpu dxe phase end cpu dxe smm phase 0x4d cpu dxe smm phase b egin 0x4e relocate sm bases for all aps 0x4f cpu dxe smm phase end i/o buses 0x50 enumerating pci buses 0x51 allocating resources to pci bus 0x52 hot plug pci controller initialization usb 0x58 resetting usb bus 0x59 reserved for usb ata/atapi /sata 0x5a resetting pata/sata bus and all devices 0x5b reserved for ata continued error messages and beep codes 67 table 28 . port 80h post codes (continued) port 80 c ode progress code enumeration bds 0x60 bds driver entry point initialize 0x61 bds service routine entry point (can be called multiple times) 0x62 bds step2 0x63 bds step3 0x64 bds step4 0x65 bds step5 0x66 bds step6 0x67 bds step7 0x68 bds step8 0x69 bds step9 0x6a bds step10 0x6b bds step11 0x6c bds step12 0x6d bds step13 0x6e bds step1 4 0x6f bds return to dxe core (should not get here) keyboard (ps/2 or usb) 0x90 resetting keyboard 0x91 disabling the keyboard 0x92 detecting the presence of the keyboard 0x93 enabling the keyboard 0x94 clearing keyboard input buffer 0x95 instruc ting keyboard controller to run self test (ps/2 only) mouse (ps/2 or usb) 0x98 resetting mouse 0x99 detecting mouse detecting presence of mouse 0x9b enabling mouse fixed media 0xb0 resetting fixed media 0xb1 disabling fixed media 0xb2 detecting presence of a fixed media (ide hard drive detection etc.) 0xb3 enabling/configuring a fixed media continued intel desktop board DCP847SKE technical product specification 68 table 28 . port 80h post codes (continued) port 80 c ode progress code enumeration removable media 0xb8 resetting removable m edia 0xb9 disabling removable media 0xba detecting presence of a removable media (ide, cdrom detection etc.) 0xb c enabling/configuring a removable media dxe core 0xe4 entered dxe phase bds 0xe7 waiting for user input 0xe8 checking password 0xe9 entering bios setup 0xeb calling legacy option roms runtime phase/efi os boot 0xf8 efi boot service exitbootservices ( ) has been called 0xf9 efi runtime service setvirtualaddressmap ( ) has been called error messages and beep codes 69 table 29 . typical port 80h post sequence post code description 21 initializing a chipset component 22 reading spd from memory dimms 23 detecting presence of memory dimms 25 configuring memory 28 testing memory 34 loading recovery capsule e4 entered dxe phase 12 star ting application processor initialization 13 smm initialization 50 enumerating pci buses 51 allocating resourced to pci bus 92 detecting the presence of the keyboard 90 resetting keyboard 94 clearing keyboard input buffer 95 keyboard self test eb c alling video bios 58 resetting usb bus 5a resetting pata/sata bus and all devices 92 detecting the presence of the keyboard 90 resetting keyboard 94 clearing keyboard input buffer 5a resetting pata/sata bus and all devices 28 testing memory 90 rese tting keyboard 94 clearing keyboard input buffer e7 waiting for user input 01 int 19 00 ready to boot intel desktop board DCP847SKE technical product specification 70 71 5 regulatory compliance and battery disposal information 5.1 regulatory compliance this section contains the following regulatory compliance informatio n for intel next unit of computing board DCP847SKE : ? safety standards ? european union declaration of conformity statement ? product ecology statements ? electromagnetic compatibility (emc) standards ? product certification markings 5.1.1 safety standards intel next uni t of computing board DCP847SKE complies with the safety standards stated in table 30 when correctly installed in a compatible host system. table 30 . safety standards standard title csa/ul 60950 -1 informat ion technology equipment ? safety - part 1: general requirements (usa and canada) en 60950 -1 information technology equipment ? safety - part 1: general requirements (european union) iec 60950 -1 information technology equipment ? safety - part 1: gener al requirements (international) intel desktop board DCP847SKE technical product specification 72 5.1.2 european union declaration of conformity statement we, intel corporation, declare under our sole responsibility that the product s intel ? next unit of computing board DCP847SKE is in conformity with all applicable essentia l requirements necessary for ce marking, following the provisions of the european council directive 2004/108/ec (emc directive) , 2006/95/ec (low voltage directive) , and 2002/95/ec (rohs directive) . the product is properly ce marked demonstrating this confo rmity and is for distribution within all member states of the eu with no restrictions. this product follows the provisions of the european directives 2004/108/ec , 2006/95/ec , and 2002/95/ec . ?e?tina tento vyrobek odpovd po?adavk?m evropskych smrnic 2 004/108/ec , 2006/95/ec a 2002/95/ec . dansk dette produkt er i overensstemmelse med det europ?iske direktiv 2004/108/ec, 2006/95/ec & 2002/95/ec . dutch dit product is in navolging van de bepalingen van europees directief 2004/108/ec, 2006/95/ec & 2002/95/ ec . eesti antud toode vastab euroopa direktiivides 2004/108/ec, ja 2006/95/ec ja 2002/95/ec kehtestatud n?uetele. suomi t?m? tuote noudattaa eu - direktiivin 2004/108/ec, 2006/95/ec & 2002/95/ec m??r?yksi?. fran?ais ce produit est conforme aux exigences de la directive europenne 2004/108/ec, 2006/95/ec & 2002/95/ec . deutsch dieses produkt entspricht den bestimmungen der europ?ischen richtlinie 2004/108/ec, 2006/95/ec & 2002/95/ec . ??????? ? ? ??? ??????? ?? ????? ?? ?????? ????? 2 004/108/ec, 2006/95/ec ? 2002/95/ec . magyar e termk megfelel a 2004/108/ec, 2006/95/ec s 2002/95/ec eurpai irnyelv el?rsainak. icelandic tessi vara stenst reglugere evrpska efnahags bandalagsins nmer 2004/108/ec, 2006/95/ec, & 2002/95/ec . itali ano questo prodotto conforme alla direttiva europea 2004/108/ec, 2006/95/ec & 2002/95/ec . latvie?u ?is produkts atbilst eiropas direktvu 2004/108/ec, 2006/95/ec un 2002/95/ec noteikumiem. lietuvi? ?is produktas atitinka europos direktyv? 2004/108/ec , 2006/95/ec, ir 2002/95/ec nuostatas. malti dan il - prodott hu konformi mal - provvedimenti tad - direttivi ewropej 2004/108/ec, 2006/95/ec u 2002/95/ec . norsk dette produktet er i henhold til bestemmelsene i det europeiske direktivet 2004/108/ec, 2006/95/ec & 2002/95/ec . polski niniejszy produkt jest zgodny z postanowieniami dyrektyw unii europejskiej 2004/108/ec, 206/95/ec i 2002/95/ec . regulatory compliance and battery disposal information 73 portuguese este produto cumpre com as normas da diretiva europia 2004/108/ec, 2006/95/ec & 2002/95/ec . espa?ol este pr oducto cumple con las normas del directivo europeo 2004/108/ec, 2006/95/ec & 2002/95/ec . slovensky tento produkt je v slade s ustanoveniami eurpskych direktv 2004/108/ec, 2006/95/ec a 2002/95/ec . sloven??ina izdelek je skladen z dolo?bami evropskih direktiv 2004/108/ec, 2006/95/ec in 2002/95/ec . svenska denna produkt har tillverkats i enlighet med eg - direktiv 2004/108/ec, 2006/95/ec & 2002/95/ec . trk?e bu rn, avrupa birli?inin 2004/108/ec, 2 006/95/ec ve 2002/95/ec y?nergelerine uyar. 5.1.3 product ecology statements the following information is provided to address worldwide product ecology concerns and regulations. 5.1.3.1 disposal considerations this product contains the following materials that may be regulated upon disposal: lead solder on the printed wiring board assembly. 5.1.3.2 recycling considerations as part of its commitment to environmental responsibility, intel has implemented the intel product recycling program to allow retail consumers of intel?s bra nded products to return used products to selected locations for proper recycling. please consult the http://www.intel.com/intel/other/ehs/product_ecology for the details of this program, including the scope of covered products, available locations, shipping instructions, terms and conditions, etc. ?????????? intel product recycling program ?????????????????? ???? http://www.intel.com/intel/other/ehs/product_ecology ????p??????? deutsch als teil von intels engagement fr den umweltschutz hat das unternehmen das intel produkt - recyclingprogramm implementiert, das einzelhandelskunden von intel markenprodukten erm?glicht, gebrauchte produkte an ausgew?hlte standorte fr ordnungsgem??es recycling zurckzugeben. details zu diesem programm, einschlie?lich der darin eingeschlossenen produkte, verfgbaren standorte, versandanweisungen, bedingungen usw., finden sie auf der http://www.intel.com/intel/other/ehs/product_ecology intel desktop board DCP847SKE technical product specification 74 espa?ol como parte de su compromiso de responsabilidad medioambiental, intel ha implantado el programa de reciclaje de productos intel, que permite que los consumidores al detalle de los productos intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado. consulte la http://www.intel.com/intel/other/ehs/product_ecology pa ra ver los detalles del programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de envo, trminos y condiciones, etc. fran?ais dans le cadre de son engagement pour la protection de l'environnement, intel a mis en ?uvre le programme intel product recycling program (programme de recyclage des produits intel) pour permettre aux consommateurs de produits intel de recycler les produits uss en les retournant des adresses spcifies. visitez la page web http://www.intel.com/intel/other/ehs/product_ecology pour en savoir plus sur ce programme, savoir les produits concerns, les adresses disponibles, les instructions d'expdition, les conditions gnrales, etc. ?Z ???ho??h???K? ?u???????m??u?? ??k?? u????s????? http://www.intel.com/in tel/other/ehs/product_ecology ?Z E malay sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran, intel telah melaksanakan program kitar semula produk untuk membenarkan pengguna - pengguna runcit produk jenama intel memulangkan produk terguna ke lokasi - lokas i terpilih untuk dikitarkan semula dengan betul. sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan butir - butir program ini, termasuklah skop produk yang dirangkumi, lokasi - lokasi tersedia, arahan penghantaran, terma & syarat, dsb. portuguese como parte deste compromisso com o respeito ao ambiente, a intel implementou o programa de reciclagem de produtos para que os consumidores finais possam enviar produto s intel usados para locais selecionados, onde esses produtos s?o reciclados de maneira adequada. consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em ingls) para ob ter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os locais disponveis, as instru??es de envio, os termos e condi??es, etc. regulatory compliance and battery disposal information 75 russian ???? ? ?? ????? ???? ?? , intel ???? ???? ?????? ??? intel (product recycling program) ?? ???????? ???? ?????? ?? ??? intel ????? ???? ????? ??? ????? ????? ?? ?? ???? ?????? . ???? , ???? ? ?? - ?? http://www.intel.com/intel/other/ehs/product_ecology ? ?????? ???? , ??????? ??? , ??? ??? , ???? ??? , ????? ??? . . trk?e intel, ?evre sorumlulu?una ba??ml?l???n?n bir par?as? olarak, perakende tketicilerin intel markal? kullan?lm?? rnlerini belirlenmi? merkezlere iade edip uygun ?ekilde geri d?n ?trmesini ama?layan intel rnleri geri d?n?m program?n? uygulamaya koymu?tur. bu program?n rn kapsam?, rn iade merkezleri, nakliye talimatlar?, kay?tlar ve ?artlar v.s dahil btn ayr?nt?lar?n? ?grenmek i?in ltfen http://www.intel.com/intel/other/ehs/product_ecology web sayfas?na gidin. 5.1.4 emc regulations intel next unit of computing board DCP847SKE compl ies with the emc regulations stated in table 31 when correctly installed in a compatible host system. table 31 . emc regulations regulation title fcc 47 cfr part 15, subpart b title 47 of the code of federal regulations, part 15, subpart b, radio frequency devices. (usa) ices - 003 interference - causing equipment standard, digital apparatus. (canada) en55022 limits and methods of measurement of radio interference characteristics of information technology equipment. (european union) en55024 information technology equipment ? immunity characteristics limits and methods of measurement. (european union) en55022 australian communications authority, standard for electromagnetic compatibility. (australia and new zealand) cispr 22 limits and methods of measurement of radio disturbance characteristics of information technology equipment. (international) cispr 24 information technology equipment ? immunity characteristics ? limits and methods of measurement. (international) vcci v -3 , v -4 voluntary control for interference by information technology equipment. (japan) kn - 22, kn - 24 korean communications commission ? framework act on telecommunications and radio waves act (south korea) cns 13438 bureau of standards, metrology, and inspection (taiwan) intel desktop board DCP847SKE technical product specification 76 fcc declaration of conf ormity this device complies with part 15 of the fcc rules. operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that ma y cause undesired operation. for questions related to the emc performance of this product, contact: intel corporation, 5200 n.e. elam young parkway, hillsboro, or 97124 1- 800 - 628 - 8686 this equipment has been tested and found to comply with the limits fo r a class b digital device, pursuant to part 15 of the fcc rules. these limits are designed to provide reasonable protection against harmful interference in a residential installation. this equipment generates, uses, and can radiate radio frequency energ y and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. however, there is no guarantee that interference will not occur in a particular installation. if this equipment does cause harmf ul interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: ? reorient or relocate the receiving antenna. ? i ncrease the separation between the equipment and the receiver. ? connect the equipment to an outlet on a circuit other than the one to which the receiver is connected. ? consult the dealer or an experienced radio/tv technician for help. any changes or modifica tions to the equipment not expressly approved by intel corporation could void the user?s authority to operate the equipment. tested to comply with fcc standards for home or office use. canadian department of communications compliance statement this digital apparatus does not exceed the class b limits for radio noise emissions from digital apparatus set out in the radio interference regulations of the canadian department of communications. le prsent appareil numerique nmet pas de bruits radiolectriques d passant les limites applicables aux appareils numriques de la classe b prescrites dans le rglement sur le broullage radiolectrique dict par le ministre des communications du canada. regulatory compliance and battery disposal information 77 japan vcci statement japan vcci s tatement translation: t his is a class b product based on the standard of the voluntary control council for interference from information technology equipment (vcci). if this is used near a radio or television receiver in a domestic environment, it may cause radio interference. install and use the equipment according to the instruction manual. korea class b statement korea class b statement translation: this equipment is for home use, and has acquired electromagnetic conformity registration, so it can be used not only in residential areas, but also other areas. intel desktop board DCP847SKE technical product specification 78 5.1.5 energy star* 5. 2 , e - standby, and erp compliance the us department of energy and the us environmental protection agency have continually revised the energy star requirements. intel has worked directly with these two governmental agencies in the definition of new requirements. intel next unit of computing board DCP847SKE meet s the following program requirements in an adequate system configuration, including appropriate selection of an efficient power supply: ? energy star v5 .2 , category b ? epeat* ? korea e - standby ? european union energy - related products directive 20 13 (erp) lot 6 note energy star compliance is based at the system level not the board level. use of an intel next unit of computing board alone does not guarantee energy star compliance. for information about refer to energy star requirements and recommended configurations http://www.intel.com/go/energystar electronic product envir onmental assessment tool (epeat) http://www.epeat.net/ korea e - standby program http://www.kemco.or.kr/new_eng/pg02 /pg02100300.asp european union en ergy - related products directive 2009 (erp) http://ec.europa.eu/enterprise/policies/s ustainable - business/sustainable - product - policy/ecodesign/index_en.htm regulatory compliance and battery disposal information 79 5.1.6 regulatory compliance mark s (board level) intel next unit of computing board DCP847SKE has the regulatory compliance mark s shown in table 32 . table 32 . regulatory compliance mar ks description mark ul joint us/canada recognized component mark. includes adjacent ul file number for intel next unit of computing board s: e210882. fcc decla ration of conformity logo mark for class b equipment. ce mark. declaring compliance to the european union (eu) emc directive , low voltage directive, and rohs directive. australian communications authority (aca) and new zealand radio spectrum management (nz rsm) c - tick mark. includes adjacent intel supplier code number, n - 232. japan vcci (voluntary control council for interference) mark. korea certification mark. includes an adjacent kcc (korean communications commission) certification number: kcc - rem - cpu - DCP847SKE . taiwan bsmi (bureau of standards, metrology and inspections) mark. includes adjacent intel company numb er, d33025. printed wiring board manufacturer?s recognition mark. consists of a unique ul recognized manufacturer?s logo, along with a flammability rating (solder side). v-0 china rohs/environmentally friendly use period logo: this is an example of t he symbol used on intel next unit of computing board s and associated collateral. the color of the mark may vary depending upon the application. the environmental friendly usage period (efup) for intel next unit of computing board s has been determined to be 10 years. intel desktop board DCP847SKE technical product specification 80 5.2 battery disposal information caution risk of explosion if the battery is repl ac ed with an incorrect type. batteries should be recycled where possible. disposal of used batteries must be in accordance with local environmental regulation s. prcaution risque d'explosion si la pile usage est rempl ac e par une pile de type incorrect. les piles usages doivent tre recycles dans la mesure du possible. la mise au rebut des piles usages doit respecter les rglementations locales en vigueur en matire de protection de l'environnement . forholdsregel eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. batterier b?r om muligt genbruges. bortskaffelse af brugte batterier b?r foreg? i overensstemmelse med g?ldende milj?lovgi vning. obs! det kan oppst? eksplosjonsfare hvis batteriet skiftes ut med feil type. brukte batterier b?r kastes i henhold til gjeldende milj?lovgivning. viktigt! risk f?r expl osion om batteriet ers?tts med felaktig batterityp. batterier ska kasseras enligt de lokala milj?v?rdsbest?mmelserna. varo r?j?hdysvaara, jos pariston tyyppi on v??r?. paristot on kierr?tett?v?, jos se on mahdollista. k?ytetyt paristot on h?vitett?v? paikallisten ymp?rist?m??r?ysten mukaisesti. vorsicht bei falschem einsetzen einer neuen batterie besteht explosionsgefahr. die batterie darf nur durch denselben oder einen entsprechenden, vom hersteller empfohlenen batterietyp ersetzt werden. entsorgen sie verbrauchte batterien den anweisungen des hers tellers entsprechend. avvertimento esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto. utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. per disfarsi delle pile usate, seguire le is truzioni del produttore. regulatory compliance and battery disposal information 81 precaucin existe peligro de explosin si la pila no se cambia de forma adecuada. utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. para deshacerse de las pilas usadas, siga ig ualmente las instrucciones del fabricante. waarschuwing er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. batterijen moeten zoveel mogelijk worden gerecycled. houd u bij het weggooien van gebruikte batterijen a an de plaatselijke milieuwetgeving. aten??o haver risco de explos?o se a bateria for substituda por um tipo de bateria incorreto. as baterias devem ser recicladas nos locais apropriados. a elimina??o de baterias usadas deve ser feita de acordo com as regulamenta??es ambientais da regi?o. a?ciaro?zna?? ?? ?? ?? , ??? ??????? ????? ???????? . ????? ???? , ?????? , ?????? . ????? ? ? ?????? ??? ???? ?? ?????????? ????? . upozornn v p?pad vymny ba terie za nesprvny druh m??e dojt k vybuchu. je - li to mo?n, baterie by mly byt recyklovny. baterie je t?eba zlikvidovat v souladu s mstnmi p?edpisy o ?ivotnm prost?ed. ????? ????? ?????? ?? ???? ? ????? ? ??? ???????? ? ? ? ??????? ?? . ? ???? ? ?? ? ????????? ?? ?? ???? ?? ???? . ????? ?? ????????????? ???? ?? ? ???? ????? ? ??? ?? ? ???|????????? ????????? . vigyzat ha a telepet nem a megfelel ? tpus telepre cserli, az felrobbanhat. a telepeket lehet?sg szerint jra kell hasznostani. a hasznlt telepeket a helyi k?rnyezetvdelmi el?rsoknak megfelel?en kell kiselejtezni. intel desktop board DCP847SKE technical product specification 82 awas risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. bateri sepatutnya dikitar semula jika boleh. pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. ostrze?enie istnieje niebezpieczestwo wybuchu w przypadku zastosowania niew?a?ciwego typu baterii. zu?yte ba terie nale?y w miar? mo?liwo?ci utylizowa? zgodnie z odpowiednimi przepisami ochrony ?rodowiska. precau?ie risc de explozie, dac? bateria este ?nlocuit? cu un tip de baterie necorespunz?tor. bateriile trebuie reciclate, dac? este posibil. depozitarea bateriilor uzate trebuie s? respecte reglement?rile locale privind protec?ia mediului. ??????? ??????? ???? ??????? ? ??? ? ? ??? . ???? ???? ? ???????? ????? . ?????? ???? ???? ??? ????? , ???? ??? ?????? . upozornenie ak batriu vymente za nesprvny typ, hroz nebezpe?enstvo jej vybuchu. batrie by sa mali pod?a mo?nosti v?dy recyklova?. likvidcia pou?itych batri sa mus vykonva? v slade s miestnymi predpismi na ochranu ?ivotnho prostredia. pozor zamenjava baterije z baterijo druga?nega tipa lahko povzro?i eksplozijo. ?e je mogo?e, bateri je reciklirajte. rabljene baterije zavrzite v skladu z lokalnimi okoljevarstvenimi predpisi. uyari yanl?? trde pil tak?ld???nda patlama riski vard?r. piller mmkn oldu?unda geri d?n?trlmelidir. kullan?lm?? piller, yerel ?evre yasalar?na uygun olarak at?lmal?d?r . o? ?????? ???? ?????? ?, ???? ?????? ??? ???. ? ?????, ?????? ???? ? ?????. ????? ??????? ???? ?? ? ?????? ???? ???? ?, ??? ? ?????. regulatory compliance and battery disposal information 83 intel desktop board DCP847SKE technical product specification 84 |
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